Nordson Intelligence AI is reshaping the X-ray process

From Static Images to Intelligent Insights

Within semiconductor packaging and advanced electronics assembly, X-ray inspection plays a critical role in verifying internal structures and ensuring device reliability. Traditional X-ray inspection has long leveraged machine vision algorithms, effectively employing contrast, shape, and intensity thresholds to pinpoint potential defects – methods that have historically proven robust across many applications. As modern electronics have evolved in complexity, however, the nuanced nature of these designs, featuring overlapping components, stacked die structures, and subtle material variations, has presented a growing need for advanced interpretation. For example, a resistor positioned over a Ball Grid Array (BGA) ball might create darkerregions that legacy systems could misclassify as defects, reducing inspection efficiency and leading to higher false call rates. Even beyond these challenges, achieving consistent, high-quality inspection still relies heavily on skilled engineers, demanding deep expertise, constant calibration, and process knowledge that’s difficult to scale. AI, particularly deep learning, fundamentally changes this paradigm. Instead of relying on rigid, pre-programmed rules, AI models learn to distinguish genuine defects from background noise by analyzing vast inspection datasets.“AI changes the game," explains Charlie Zhu,.......