The MaxVIA, MaxVIA Plus, ModVIA, and MegaVIA systems deliver various plasma cleaning, surface activation, and adhesion improvement capabilities to suit through-hole and blind VIA applications.

You’ll receive your new system with minimal lead time when you choose a standard system package.

The VIA Series:

• High Flux Electrode (HFE) design with a temperature-controlled cooling loop delivers superior plasma treatment uniformity for PCB panel, desmear, landing pad cleaning, etchback, and flexible and rigid circuit board applications.
• Low CF4 gas consumption for desmear and etchback applications contributes to the lowest cost of ownership in their class.
• A single space-saving enclosure houses the vacuum system, plasma chamber, control electronics, and power supply.
• The systems accommodate various panel sizes and are ideal for high-volume, low-volume, and high-mixture environments.
• Accommodate panel sizes up to 30 x 52 inches with the MegaVIA plasma system.
  
  

MaxVIA, MaxVIA Plus, and ModVIA packages:

• Essential  – These essential 40 kHz plasma treatment systems deliver high process repeatability and uniformity and accommodate all common gases, including CF4, oxygen, nitrogen, and argon.

• Productivity – Accelerate throughput and yield with a power-power electrode configuration that allows both sides of the substrate to receive exceptionally uniform etchback treatment. Balanced vacuum, gas flow, and temperature management technologies enhance optimal performance.

MegaVIA package:

• Essential – Accelerate throughput and yield for large panels. Accommodate panel sizes up to 30 x 52 inches. Accelerate throughput and yield with a power-power electrode configuration that allows both sides of the substrate to receive exceptionally uniform etchback treatment. Balanced vacuum, gas flow, electrode design, and temperature management technologies enhance optimal performance.