FOOMA 2022 2

Learn about MARCH plasma treatments used in advanced wafer-level packaging. Wafer-level packaging has become the fastest growing IC packaging technology in the industry. This conference is sponsored by the SMTA, and uses the theme, Advanced Packaging: The Dawn of a New Era.

Tuesday February 15th 2022, Session 3 at 1:30pm Al Bousetta, director of marketing, MARCH Products will present the paper, "Effective Plasma Treatments for Advanced Wafer Level Packaging".

Additional Details

One way for most integrated-circuit (IC) manufacturers to extend Moore's law and preserve their edge on their circuits’ small sizes, low costs, and high performance is to incorporate newer advanced chip-packaging technologies into their production processes. One of these advanced technologies is silicon-based wafer-level packaging, such as fan-out wafer-level packaging. As the semiconductor industry shifts focus to more than Moore’s law, plasma treatment in the back-end wafer-level packaging process is gaining importance due to a combination of high-reliability applications and the high-density requirements of the advanced packaging technologies being used. In this article, we have evaluated plasma treatment for advanced WLP applications. The results show that plasma can be effectively used to improve the surface wettability of the photoresist prior copper electroplating, remove photoresist scum residues, and eliminate sacrificial layer residues after carrier debonding.

For more information: https://smta.org/mpage/wafer-register/