Low Pressure Molding
Low-pressure molding technology is widely used for the encapsulation and protection of precision and sensitive electronic components. It is mainly applied for insulation, shock resistance, moisture protection, and chemical corrosion resistance.
Overview
Nordson low pressure molding solution can protect electronic components both during manufacturing and in end-use applications. It is a compact system that is easy to be integrated into the production line and convenient for installation and maintenance.
Low-pressure molding applications include:
- PCB circuit boards encapsulation
- Wire harness encapsulation
- Plug-in component molding
- Sensor encapsulation
- Coil encapsulation
- Connector encapsulation
- Other specialized molding applications
Value Propositions
- Significantly simplify the manufacturing process of end products
- Shorten production cycles
- Enhance product reliability
- Reduce production costs
- Improve production efficiency
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