Compact Footprint & 41 UPH - Embrace the future of Wafer Inspection

Spin Scanning Acoustic  Microscopy

The latest product from Nordson TEST & INSPECTION  is an automated inspection tool which delivers high throughput and better sensitivity for accurately locating defects in wafer-based assemblies. Successful applications include bonded wafers, Chip-on-Wafer, stacked wafers, MEMS, over-molded wafers and more. 

The Fastest Data Collection Possible 41 WPH@100μm

‌A key feature of the SpinSAM is the use of a continuous non-stop scan path. Using FOUR combined scanners (each capable of 100 WPH @ 100 μm) that provide unmatched speed. Back-to-back jobs can also be scheduled. Once the last FOUP is loaded, another job can start.Spin scan up to four wafers simultaneously with matched transducers, wafers can be inspected over the widest frequency rage ever achieves in a production environment. These proprietary Waterfall transducers ‌provide non-immersion scanning which minimize the risks of contamination and false bond indications.

 

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