4600-W Automated Bondtester

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4600-W Automated Bondtester

Improve reliability and throughput while reducing human influence.

Overview


The 4600-W Bondtester is a benchtop system designed to automatically perform complex test procedures without needing operator input. The system can automatically complete shear and pull test patterns with different orientations of bonds, while recording failure mode images upon completion.

Specifications at a Glance


Automation
Automation programmes Camera assisted fiducial recognition
Wafer map import  Sinf, Klarf and G85
Wafer ID reading Via OCR
Sample handling Wafer
Light Tower system  Included as standard
Testing
Topology information  Compound Surface Imaging  (CSI) + auto-focus              
Grading assistance Automatic area calculation upgrade

Step back accuracy (force dependent)

 

+/- 0.25μm 
System accuracy (range dependent) +/- 0.10 % - 0.05 % FSL
Multifunctional cartridge Combinations of shear and pull transducers
Axis specification
Stage and resolution  100 nm Renishaw linear encoders
X, Y travel  450 mm X, 410 mm Y 
X, Y speed and force 50 mm/s 20 kg or 30 mm/s, 50 kg
Z travel and resolution  75 mm, 5 mm/s
Z speed and force 5 mm/s, up to 50 kg 
Installation 
Footprint (W x D x H )            1075 mm x 920 mm x 1000 mm
Weight 140 kg
Power supply  90-264 V, AC Single phase
Pneumatic supply 4 Bar, 6 mm OD / 4 mm ID plastic pipe
Vacuum supply  Minimum 500 mm Hg plastic pipe

Life with Automation


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Operator free - remove all errors


Load large batches of samples and benefit from robotic handling to load, align and transfer each device to the Bondtester.

Paragon - Your Automation Software


  • Automation assisted GUI
  • Build in check list & help
  • Multi window views
  • Schematic virtual images displayed
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Automated Testing


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Ultimate Product Safety


 Using robotic handling with vacuum you can safely load and unload your product and protect from handling errors and damage. There is no risk of losing a batch and no need to ever repeat a test.

Maximum UPH


Fully integrated cassette handling and mapping capabilities combined with device mapping delivers maximum efficiency. Achieve consistent UPH results 24/7 regardless of who is operating the Bondtester.
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Repeatable Results Every Time


Our linear encoder stages with 100nm resolution ensure you get to the right location every time.

Data is Everything


Achieve maximum data integrity with multiple on-board cameras to recognize fiducial markings and automatically capture failure mode images.

Remove the Expert


'Paragon™ software is easy to use and simple to set-up for a new product, meaning you don;t need to rely on expert operators as a single point of failure. A single operator can manage multiple systems if required.

Improve Tool ROI


'Start the test then attend to other work while the system automatically completes large batch testing. Tests can be controlled and data exported using SECS/GEM protocols integrated with your factory.