SpinSAM - Game Changer of Wafer Inspection
Let's put it in a few words:
- Industry leading throughput on 300mm wafer inspection
- Best in class footprint / UPH
- Leading defect capture and image quality
- Modular design for ease of serviceability
- Fully automated inspection and analysis with factory communication
Bryan Schackmuth, Product Manager at Nordson TEST & INSPECTION for AMI products, emphasizes: What truly distinguishes SpinSAM is its innovative spinning scan method, meticulously engineered to maximize Units Per Hour (UPH) without compromising accuracy. From bonded wafers to MEMS and everything in between, SpinSAM handles it all with ease. Coupled with advanced Global Tool Matching feature, this revolutionary approach ensures that SpinSAM can detect the smallest defects with unparalleled precision, allows you to use the same settings across different SpinSAM systems, guaranteeing matching results regardless of location. With global tool matching, you can maintain uniformity in your inspection process, streamline operations, and achieve unparalleled quality control standards across your entire semiconductor manufacturing ecosystem.
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