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AltaSpray™-c Applicators
AltaSpray™-c applicators provide the flexibility and performance capabilities of a single-platform, hot melt adhesive dispensing design.
Overview
The initial investment and ongoing cost of ownership are reduced from the applicators’ streamlined, economical configuration.
Simplified system connectivity and fewer cabling requirements optimize the applicator’s use with AltaBlue™ series adhesive melters.
AltaSpray-c applicators are compatible with Universal™ modules.
Such modules accept numerous dispensing technologies, including CF200, Universal CF, Summit™, Rhythm™ Construction and Signature® nozzles for lamination, and Universal SureWrap®, Rhythm™ Elastic and Allegro™ nozzles for elastic attachment.
Specifications
| Module compatibility | Universal UM25 |
| Operating temperature | 70° to 191° C (160° to 375° F) |
| Working hydraulic pressure | 13.8 to 55.2 bar (200 to 800 psi) |
| Maximum hydraulic pressure | 89.6 bar (1300 psi) |
| Maximum hydraulic flow (per module) | 110 grams per minute at 10,000 centipoise, 21 grams per square meter at 200 m/min |
| Actuation air pressure1 | 4.1 bar (60 psi) recommended |
| Maximum process air flow | 1.2 scfm @ 191° C (375° F), 1.5 scfm @ 177° C (350° F) |
1 Oil-free air must be used.
Features and Benefits
- produce high bond strength at low add-on rates in continuous and intermittent operations.
- control adhesive fiber size, density and pattern width for better bond performance.
Resources & Downloads
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Brochures & Data Sheets
