Access Confirmation Code White Paper - Implications of Using Lead-Free Solders on X-ray Inspection of Flip Chips and BGAs

Access Confirmation Code White Paper - Implications of Using Lead-Free Solders on X-ray Inspection of Flip Chips and BGAs

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Implications of Using Lead-Free Solders on X-ray Inspection of Flip Chips and BGAs

This paper reviews the methods of finding defects in BGAs, QFNs, and 3D packages using X-Ray inspection with real-life examples provided......