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Date
2022-04-11 - 2022-04-11
The new Dual-Mode MRS sensor in the CyberOptics SE3000™ SPI system provides maximum flexibility for dedicated solder paste inspection applications, with one mode for high-speed inspection and another mode for high resolution inspection. The new sensor is an extension of the proprietary MRS sensor portfolio that provides industry-leading performance in semiconductor and SMT markets. The SE3000 is ideal for measuring height, area, volume, registration and bridging, as well as detecting insufficient paste, excess height, smear, offset and more.
The AXI X-series is a special autonomous high speed automatic X-ray inspection system concept for the inspection of PCB-assembly boards for single/multipanels or samples in trays. All solder joints of SMD and PTH components are covered by a dedicated AXI algorithm library.