Nordson EFD

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FluxPlus Paste Flux

Formulated to work with any alloy and heating process, Nordson EFD’s FluxPlus™ is perfect for BGA rework, mobile device repair, reflowing solder paste, and more.

Unlike liquid fluxes, tacky FluxPlus can be applied exactly where needed without contaminating nearby areas. EFD provides a wide array of formulations for use in a variety of applications.

FluxPlus Families

No Clean (NC)

Consisting of rosin, solvent, and a small amount of activator, NC flux has low activity and is suited to easily soldered surfaces. NC residue is clear, hard, noncorrosive, non-conductive, and designed to be left on your assembly. Residue may be removed with an appropriate solvent.

Water Soluble (WS)

Consisting of organic acids, thixotrope, and solvent, WS flux comes in a wide range of activity levels for soldering to even the most difficult surfaces. WS flux residue is corrosive and should be removed as soon as possible after reflow to avoid damage to your assembly. Maximum safe time before cleaning is product dependent. Residue is easily removed with 60° C (140° F) water at 40 psi (3 bar) pressure.

Rosin Mildly Activated (RMA)

Consisting of rosin, solvent, and a small amount of activator, most RMA flux is fairly low in activity and best suited to easily soldered surfaces. RMA flux residue is clear, soft, non-corrosive, and non-conductive. Cleaning is optional. Residue may be removed with an appropriate solvent.

Rosin Activated (RA)

Consisting of rosin, solvent, and aggressive activators, RA flux has higher activity than RMA for moderately oxidized surfaces. RA flux residue is corrosive and should be removed as soon as possible after reflow to prevent damage to your assembly. Maximum safe time before cleaning is product dependent. Residue may be removed with an appropriate solvent.