Nordson Corporation

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22 Nov 2018

Tamper-evident pharmaceutical packaging using adhesive

System comparison between classic hotmelt application, two-shot procedure and the use of reactive PUR Hotmelt.

15 Nov 2018

Nordson DAGE’s Complete Solution for Automated On-Wafer Bondtesting Recognized with a Global Technology Award

The 4800 is the complete solution for automated on wafer bond testing ensuring virtually operator free testing.

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Precision technology that touches your life every day everywhere.


12-14 Dec 2018

SEMICON Japan 2018

Tokyo Big Site, Tokyo Japan

Come talk to us about Plasma Systems!

5-8 Jan 2019

ArabPlast 2019

Dubai World Trade Centre, Dubai, UAE

Booth 5D101/102

16-18 Jan 2019

NEPCON Japan 2019

Tokyo Big Sight, Tokyo, Japan

Visit with Nordson ASYMTEK to learn about our newest technologies

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