Nordson DAGE

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Electronics - Semiconductor

The Nordson DAGE XM8000 fully automatic wafer inspection system provides a unique solution for inspecting bumps, TSVs, MEMs and other structures on 200, 300 and 450 mm wafers.  Fully automatic wafer handling in accordance with the industry standards as well as clean room integration are part of this flexible system. This unique machine is unmatched in the marketplace in the areas of speed, accuracy, user friendly interface and measurement capabilities.

Nordson DAGE Diamond X-ray inspection systems provide the best solution for manual X-ray inspection for the semiconductor industry.  This is made possible by the unique and highest performance X-ray sources and imaging devices developed by the DAGE R&D group. Nordson DAGE bondtesters are widely used for precision destructive and non-destructive testing of components and assemblies within the semiconductor industry.  The market leading 4000Plus bondtester provides the widest range of test solutions and the best accuracy for both manual and fully automatic applications. The 4800 system is a fully automatic solution for wafer testing applications.  Both systems use the most advanced camera-assist programming techniques that assure easy set-up and extremely accurate execution.   

4000 Multipurpose Bondtester

4000 Multipurpose Bondtester The 4000 bondtester is multipurpose, capable of performing all pull and shear applications. The 4000 bondtester can be configured as a simple wire pull tester and upgraded to provide ball shear, die…

Nordson DAGE

4000 Optima Bondtester

4000 Optima Bondtester The fastest and most accurate bondtester. The Nordson DAGE 4000 Optima is optimized for fast, accurate and reliable bond testing in the volume manufacturing environment.  The combination of patented…

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4000HS High Speed Bondtester

4000HS High Speed Bondtester The Nordson DAGE 4000HS bondtester is based upon the industry standard Nordson DAGE 4000 multi-purpose bondtester platform. The 4000HS has significant differences to the mode of operation for both…

Nordson DAGE


4000Plus Bondtester

4000Plus Bondtester The second generation Nordson DAGE 4000Plus is the most advanced bondtester on the market.  Representing the best-in-class, the 4000Plus bondtester sets the industry standard in bond testing offering…

Nordson DAGE

4000W Wafer Handling System

4000W Wafer Handling System The Nordson DAGE 4000W system enables the industry standard 4000 multipurpose bondtester to interface with an industry standard wafer handler system.  This wafer handling system provides automatic…

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4300FP - Semi-Automatic Wafer Bump Testing

4300FP - Semi-Automatic Wafer Bump Testing The Nordson DAGE 4300FP eliminates manual handling of expensive wafers.  It improves cleanliness through isolation of bondtester and wafer handler and increases productivity through semi-automatic…

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4800 Bondtester

4800 Bondtester The Nordson DAGE 4800 is at the forefront of wafer testing technology catering for the testing of wafers from 200mm up to 450mm. Whilst heralding progression in bond testing technology it’s heritage…

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MatriX Series AXI

MatriX Series AXI Nordson has added to its Test and Inspection capabilities with the acquisition of MatriX Technologies  

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Paragon™ Software

Paragon™ Software Nordson DAGE’s intelligent bond testing software Paragon™ takes bond testing to the next level. Its highly intuitive and configurable interface provides quick and easy access to advanced…

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Unique Multi-Function Cartridges

Unique Multi-Function Cartridges Switch Applications in Just Seconds! Nordson DAGE’s thorough understanding of bond testing in the volume manufacturing environment underpins the no-compromise development of industry-unique…

Nordson DAGE

XM8000 Wafer X-ray Metrology Platform

XM8000 Wafer X-ray Metrology Platform The Nordson DAGE XM8000 offers fast automatic X-ray measurement of TSVs, 3D packages, MEMS and wafer bumps for voiding, fill level, overlay and other critical dimensions.

Nordson DAGE


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