Go
Search Go

FX Series AOI

Automated In-line PCB Inspection

  • 5 megapixel color imaging
  • 1 top-down & 4 side angle cameras
  • Quick set-up
  • High speed
  • High defect coverage
  • Low false failure rate

     Download Specification Sheet


     Click to view video demo

    Nordson YESTECH's advanced 5 megapixel color camera imaging technology offers high-speed PCB inspection with exceptional defect coverage. With one top down viewing
    camera and four side viewing cameras, the FX Series inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.

    Programming the FX Series is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The FX Series utilizes a standard package library to simplify training and ensure program portability across manufacturing lines.

    Advanced Fusion Lighting and newly available 5 megapixel image processing technology integrates several techniques, including color inspection, normalized correlation and rule-based algorithms, to provide complete inspection coverage with an extremely low false failure rate.

    Configurable for all line positions, the FX Series is equally effective for paste, pre / post-reflow and final assembly inspection. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.

  • Related Solutions

    Aerospace
    The Nordson YESTECH line of AOI and X-Ray systems provide a variety of inspection solutions, ideally suited to meet the demands of the aerospace imdustry.

    Automotive
    The Nordson YESTECH line of AOI and X-Ray systems provide a variety of inspection solutions, ideally suited to meet the demands of the automotive imdustry.

    Medical
    The Nordson YESTECH line of AOI and X-Ray systems provide a variety of inspection solutions, ideally suited to meet the unique demands of the medical devices imdustry.

    PCB Assembly
    Nordson YESTECH's full line of inspection systems offers cost-effective, integrated yield enhancement solutions for the printed circuit board assembly market.

    Semiconductor Packaging
    Nordson YESTECH's full line of inspection systems offers cost-effective, integrated yield enhancement solutions for the advanced semiconductor packaging market.

    Related Products

    M1 Series AOIM1 Series AOI

    The M1 AOI offers high-speed PCB inspection with exceptional defect coverage. With three megapixel resolution and telecentric optics, M1 Series inspects solder joints and verifies correct part assembly, all within a footprint less than 1 meter wide.

    M1m AOIM1m AOI

    The M1m offers high-speed microelectronic device inspection with exceptional defect coverage. With 3 micron pixel resolution and telecentric optics, the M1m provides complete inspection, all within a footprint less than 1 sq. meter.

    BX AOIBX AOI

    The BX AOI offers off-line benchtop PCB inspection with exceptional defect coverage. This benchtop system inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.

    FX-940 AOIFX-940 AOI

    The FX-940 AOI offers high-speed PCB assemblies inspection with exceptional defect coverage, inspecting solder joints and verifying correct part assembly, enabling users to improve quality and increase throughput.

    Quick Links

    About Us
    Profile | News | Events
    Articles
    |
    Technical Papers

    Products
    AOX-Ray