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Nordson MARCH FlexTRAK-WF

FlexTRAK-WF Plasma Treatment System

The FlexTRAK™-WF Plasma System is designed for high-throughput processing of semiconductor wafers (and other flat substrates) in sizes ranging from 3 in. to 200mm (8 in.) in diameter, for wafers held in open cassettes.

The patented FlexTRAK-WF plasma chamber design provides exceptional etch uniformity and process repeatability. Primary plasma applications include a variety of etching, ashing, and descum steps. Other plasma processes include contamination removal, surface roughening, increasing wettability, and enhancing bonding and adhesion strength. 

Applications include wafer processing prior to typical back-end packaging steps - suitable for wafer-level packaging, flip chip, or traditional packaging.

 Wafer Cleaning

  •          Remove contamination prior to wafer bumping
  •          Remove organic contamination
  •          Remove Fluorine and other halogen contamination
  •          Remove metal and metal oxides
  •          Improve spun-on film adhesion
  •          Clean Aluminum bond pads

Wafer Etching

  •         Descum wafer of residual photoresist / BCB
  •         Pattern dielectric layers for redistribution
  •         Strip / Etch photoresist
  •         Enhance adhesion of wafer-applied materials
  •         Remove excess wafer-applied mold / epoxy
  •         Enhance adhesion of gold, solder bumps
  •         Destress wafer to reduce breakage
  •         Improve spun-on film adhesion
  •         Clean Aluminum bond pads

Features and Benefits

  • Dual cassette load stations to minimize idle time
  • Multi-size capable aligner with minimal hardware change-over required
  • Robust robotic wafer engine
  • Integrated wafer recognition for high reliability wafer handling
  • Compact design minimizes floor space
  • Highly uniform treatment and fast throughput

Related Products

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The FlexTRAK-WR Plasma System is designed for high-throughput processing of semiconductor wafers up to 300mm (12 in.) in diameter