Image sensor device manufacturing is a rapidly growing segment of the MEMS market as more and more products are designed and built with digital camera or optical scanning capabilities.
Typical plasma applications for the manufacture of these advanced devices includes device cleaning, photoresist descum, stripping of materials like photoresist and benzocylcobutene (BCB), etching redistribution lines, and removing contamination.
Other applications include surface cleaning and roughening; chemical bond activation to improve bondability; and increasing wettability and uniformity of liquid flow over the wafer surface.
Solutions for WLP, MEMS, TFH, Image Sensors, & PV
Wafer Cleaning |
Descum | Stripping and Etch | Wafer Pre-Treatment |
BCM & UBM Adhesion |
Dielectric Patterning | Via Cleaning | Bump Adhesion