High reliability and yield in the manufacturing of advanced integrated circuits can be difficult to achieve as package sizes decrease and the use of advanced materials increases.
Many manufacturing challenges can be improved or overcome by using a suitable plasma treatment, including improving die attach, increasing wire bond strength, eliminating flip-chip underfill voids, and reducing package delamination.
Nordson MARCH manufactures manual, batch and automated plasma treatment systems specifically designed for the advanced semiconductor packaging & assembly (ASPA) industry. Nordson MARCH's plasma systems are designed to provide highly repeatable results with excellent etch rates (where required) and treatment uniformity. Our systems are also capable of handling multiple part sizes and very high-throughput production requirements.
ASPA Solutions
Die Attach |
Wire Bonding | Underfill | Encapsulation & Mold