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FlexTRAK-WR Plasma Treatment System

FlexTRAK-WR Plasma System

The FlexTRAK™-WR system is designed for high-throughput processing of semiconductor wafers up to 300mm (12 in.) in diameter. The patented plasma chamber design provides exceptional etch uniformity and process repeatability. Its three-axis symmetrical chamber ensures all areas of the wafer are treated uniformly, while tight control over all process parameters ensures highly repeatable results.

 

The universal architecture of the FlexTRAK-WR system accommodates a wide range of wafer sizes in the same systems, yielding unmatched production flexibility. Its small chamber volume and proprietary process control system provide short cycle times, with high machine autonomy.

FlexTRAK-WR is also capable of direct, downstream or ion-free plasma processing for a wide range of semiconductor applications. FlexTRAK-WR three-axis symmetrical chamber and proprietary process control provides unmatched process uniformity while minimizing cycle times.

Applications

Wafer processing prior to typical back-end packaging steps - suitable for wafer-level packaging, flip chip, or traditional packaging.

 Wafer Cleaning

  • Remove contamination prior to wafer bumping
  • Remove organic contamination
  • Remove Fluorine and other halogen contamination
  • Remove metal and metal oxides
  • Improve spun-on film adhesion
  • Clean Aluminum bond pads

Wafer Etching

  • Descum wafer of residual photoresist / BCB
  • Pattern dielectric layers for redistribution
  • Strip / Etch photoresist
  • Enhance adhesion of wafer-applied materials
  • Remove excess wafer-applied mold / epoxy
  • Enhance adhesion of gold, solder bumps
  • Destress wafer to reduce breakage

 Features and Benefits

  • Superior uniform plasma with high etch rates
  • Production-ready wafer handling
  • Autonomous machine operation
  • Easily service-able components accessible via front pull-out shelves
  • High throughput
  • Low cost of ownership