Nordson Corporation

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NASDAQ $142.89   +3.62

Wafer X-ray Metrology

Measure the Invisible™ with Nordson DAGE.  Automatic X-ray measurement of TSVs, MEMS and wafer bumps for voiding, fill level, overlay and other critical dimensions.  Also be sure to browse the rest of our x-ray inspection, bond tester and automated optical inspection (AOI) offering.

Your results for: Wafer X-ray Metrology

FX-500 Ultra 3D SPI

Nordson YESTECH

Nordson YESTECH's FX-500 ULTRA 3D SPI provides 3-D height, volume and area metrology for PCB boards with complex and small pad sizes where solder volume definition is critical for joint reliability.…

Bondtesters

Nordson Corporation

Nordson DAGE bond testers check the integrity of attachments in electronic devices.  Our equipment performs a variety of tests including wire pull, ball shear, tweezer pull and several others. 

Profile

Nordson DAGE

Founded in 1961 market leaders Nordson DAGE provide an award winning portfolio of Bondtesters and X-ray Inspection Systems for destructive and non-destructive mechanical testing and inspection of…

Manual X-ray Inspection Systems

Nordson DAGE

Nordson DAGE's award winning X-ray inspection systems offer high resolution nano-focus not only for within failure analysis laboratories but also within the production environment.

Americas X-ray Contact

Nordson DAGE

X-ray Contact for Brazil, Canada, Costa Rica, Mexico & USA

NEPCON South China 2017

Nordson DAGE

Revolutionary AOI, AXI and & Bondtesting from Nordson Test & Inspection at NEPCON South China - Stand 1H20 

Gensys DataSheet

Nordson DAGE

XD7600NT Diamond X-ray Inspection System

Nordson DAGE

Now with X-Plane™ option, The Nordson DAGE XD7600NT Diamond X-ray Inspection System is the ultimate choice for obtaining the highest magnification X-ray imaging .

Europe and Middle East X-ray Contact

Nordson DAGE

Nordson DAGE's agents and distributors throughout Europe and the Middle East offer full Sales and Service Support. Please contact your nearest office for assistance.

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