Nordson Corporation

Global Directory | Languages

NASDAQ $145.90   +0.61

Wafer X-ray Metrology

Measure the Invisible™ with Nordson DAGE.  Automatic X-ray measurement of TSVs, MEMS and wafer bumps for voiding, fill level, overlay and other critical dimensions.  Also be sure to browse the rest of our x-ray inspection, bond tester and automated optical inspection (AOI) offering.

Your results for: Wafer X-ray Metrology

Wafer X-ray Metrology

Nordson DAGE

The Nordson DAGE XM8000 offers fast automatic X-ray measurement of TSVs, 3D packages, MEMS and wafer bumps for voiding, fill level, overlay and other critical dimensions.

Nordson DAGE Launches the XM8000 Wafer X-ray Metrology Platform

Nordson DAGE

Unprecedented levels of precision, detection and throughput for fully automated wafer measurement of TSV’s, 3D packages and wafer bumps

XM8000 Wafer X-ray Metrology Platform

Nordson DAGE

The Nordson DAGE XM8000 offers fast automatic X-ray measurement of TSVs, 3D packages, MEMS and wafer bumps for voiding, fill level, overlay and other critical dimensions.

Semicon West 2017

Nordson DAGE

Learn more at booth 5644 about our award winning Bondtest and X-ray systems.  Our experts will also be on hand to discuss the XM8000 Wafer X-ray Metrology platform.

Nordson DAGE Opens Asian Clean Room Demonstration Facility

Nordson DAGE

Nordson DAGE Opens Asian Clean Room Demonstration Facility for XM8000 and Bondtester Wafer Metrology Tools

Inspection Leader Nordson DAGE Earns Its 20th Award at productronica

Nordson DAGE

XM8000 Wafer X-ray Metrology system wins a Global Technology Award

Nordson DAGE Announces Latest Order for XM8000 and Attendance at IWLPC

Nordson DAGE

The Fastest Fully Automatic X-ray Metrology tool for Wafer Bumps and TSV’s

XM8000 Brochure

Nordson DAGE

Quadra W8 Brochure

Nordson DAGE

Search Again