Nordson Corporation

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NASDAQ $170.20   -1.90


Find ball shear and wafer bond strength test equipment at Nordson

Bond strength testers help electronics manufacturers improve quality control and ensure the integrity of connections. Nordson DAGE understands the importance of checking every single bond accurately, and making adjustments to increase end-product reliability. Our bondtesters check the strength of attachments in electronic devices through a variety of tests including wafer test, wire pull test, ball shear test, tweezer pull test and several others. With Nordson bonding tests incorporated into your quality control process, you’ll gain enhanced confidence in the performance of your finished product. In addition to this equipment, be sure to browse our other quality-control products, including x-ray inspection equipment and Nordson YESTECH automated optical inspection (AOI) equipment. Contact Nordson today to learn more about our bondtesters and find the right equipment for your processes.

Vision Systems

Vision Systems Nordson DAGE offers a range of powerful optical solutions for bondtesting and micro materials testing, featuring imaging systems for failure mode analysis, alignment and live recording of tests.

Nordson DAGE

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