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Semiconductor Packaging

Nordson YESTECH is a leading global provider of Automated Optical Inspection, Conformal Coat and SPI inspection systems. The full line of inspection systems offers cost-effective, integrated yield enhancement solutions for the advanced semiconductor packaging market.

Small, high-density semiconductor integrated-chip (IC) packaging, such as ball-grid arrays (BGAs), has gained widespread developer acceptance because it enables increased device performance and printed circuit board (PCB) size reduction and introduces acceptance inspection complications. Because the ICs in these packages have hidden solder joints, Automated Optical Inspection (AOI) alone is no longer sufficient to ensure solder integrity. Accordingly, manufacturers have incorporated X-ray inspection systems, such as solutions from Nordson DAGE and Nordon MATRIX, to check area-array and IC components.

By utilizing AOI and X-Ray technologies, chip manufacturers, system assemblers and developers can reap the benefits of both without sacrificing operational throughput or test time. The result is an integrated test system that cost-effectively inspects assembled PCBs.