Nordson YESTECH

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LX-1000 AOI

The LX-1000 automated optical inspection system offers high-speed PCB assemblies inspection with exceptional defect coverage, inspecting solder joints and verifying correct part assembly, enabling users to improve quality and increase throughput.

 In-line Large Area Optical Inspection
  • Single or dual sided imaging with full travel imaging sensors
  • 630mm x 630mm large inspection area
  • Optional 3D and/or 2D automated inspection
  • Up to 100 mm clearance
  • Heavy duty conveyor options for samples to 15kg
  • High defect coverage / low false failure rate
  • MES / Industry 4.0 compatible

Nordson YESTECH’s advanced multi-purpose, large area, double-sided inspection system offers high speed PCB inspection with exceptional defect coverage. With dual sided top-down and bottom up viewing sensors, the LX-1000 inspects solder joints and verifies correct part assembly, enabling users to improve quality and enhance yields.

Advanced 2D and 3D sensors and newly available image processing technology integrates several techniques, including fringe projection, color inspection, normalized correlation and rule-based algorithms, to provide complete inspection metrology with an unmatched low false failure rate.

Programming the LX-1000 is fast and intuitive. Operators typically take less than 60 minutes to create a complete inspection program including solder inspection. The LX-1000 utilizes a standard package library to simplify training and ensure program portability across manufacturing lines. 

The LX-1000 is highly effective for selective solder, post wave and connector inspections. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.

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