Nordson YESTECH's FX-500 ULTRA 3D SPI provides 3-D height, volume and area metrology for PCB boards with complex and small pad sizes where solder volume definition is critical for joint reliability.…
Nordson YESTECH's new NYTVision Inspection Software provides the latest computing technologies (64 bit, multi-core, multi-thread CPU, GPU acceleration) plus cutting-edge machine vision technologies,…