Nordson MARCH

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SEMICON China 2018

Hall N3, booth no 3231

Shanghai New International Expo Centre, China

14 Mar 2018 - 16 Mar 2018

Learn about our new wafer processing plasma treatment system

Designed for wafer processing, Nordson MARCH's SPHERE™ series plasma systems are ideal for wafer-level and 3D packaging applications. Our new MesoSPHERETM plasma system enables very high throughput processing and can handle wafers up to 450mm and panels up to 480mm.

Nordson MARCH's FastTRAK® automated series delivers high throughput plasma processing for semiconductor and electronics packaging.

Also, come see Nordson DAGE and Nordson ASYMTEK.

For more information about the show, visit the SEMICON China website.

We hope to see you in Shanghai!


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