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ICEPT 2019

Hong Kong, China

2019-08-11 - 2019-08-15

Visit Nordson MARCH in Hong Kong at ICEPT 2019

ICEPT 2019

Dr. Jack Zhao will present a paper, “Plasma Applications for Wafer Level Packaging, Part 1,” 

In this paper, typical plasma applications for WLP, such as improving Cu-PI interface adhesion, increasing the PI surface roughness, reducing the current leakage in WLP, the oxide removal from bump surface, avoiding microvoids between Cu seed layer and electric Cu plating layer, TSV cleaning, EMC removal from solder balls on wafer, and wafer-on-frame treatment, are mentioned.  Some first-hand data are shown and discussed in the part 1 of this paper.  The results indicate that plasma treatment is the recommended process for enhancing interface adhesion, roughening the surface, removing oxide on bumps, and avoiding microvoids in WLP.

August 11-15, 2019

For more information visit the ICEPT website.
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