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Are You Getting to the
Bottom of Your Via?

New VIA™ Series 2.5 cleans deep, narrow
vias where other processes can’t go!

Nordson
MARCH
Receives
NPI Award

for its RollVIA Self-
contained Vacuum
Plasma System

The Effects of Plasma Treatment Prior to Conformal Coating
White Paper Download

New research shows the results of RF plasma processing on conformal coating adhesion, conformity of the coating coverage, and the resulting effects on electrical functionality

Plasma Solutions for Surface Preparation

Plasma surface preparation removes contaminants and activates surfaces to improve adhesion and promote fluid flow

Plasma Solutions for Semiconductor Packaging

Nordson MARCH offers plasma processing for semiconductor packaging and MEMS assembly - cleaning, descum, bump adhesion, stripping and etch

Plasma Solutions for Printed Circuit Board (PCB) Manufacturing

Plasma treatment cleans and desmears PCBs to enable lamination and wettability for plating through-holes, remove resin smear from PCB drilling and clean blind vias

Plasma Solutions for Medical Device Manufacturing

Nordson MARCH's plasma equipment removes contaminants & activates surfaces for improved bonding, increased wettability, lubricity and biocompatibility

Plasma Solutions for Wafer-Level Packaging

Nordson MARCH equipment delivers high-throughput plasma processing for wafer level packaging (WLP) including cleaning, descum, adhesion, stripping and etch, patterning, via cleaning

Advanced Plasma Cleaning Systems, Solutions and Expertise for Multiple Manufacturing Industries

Nordson MARCH is the global leader in advanced plasma surface treatment systems for the Semiconductor, Printed Circuit Board, Life Science, Hard Disk Drive, LED, and Solar / Photovoltaic industries. We design and manufacture a complete line of plasma cleaning equipment, and maintain an expert staff of scientists and engineers focused on plasma cleaning.

News

03 Sep 2019

Nordson MARCH Experts to Discuss Innovative Plasma Treatments for Semiconductor Packaging at SEMICON Taiwan

Exhibiting with partner Premtek International, Inc. in booth N0276

07 Aug 2019

Nordson MARCH to Present Paper on Plasma Applications for Wafer-Level Packaging at ICEPT

Dr. Jack Zhao shares data for WLP improvements with plasma treatment

28 Mar 2019

Nordson MARCH FlexTRAK®-SHS High-capacity Plasma Treatment System Provides Enhanced Automation and Production Flexibility

High-throughput plasma processing and cleaning for semiconductor and electronics packaging

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