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Thermal Interface Materials (TIM)

Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. 

Conventional, silicone-based thermal compound and greases tend to spread after a number of heating and cooling cycles (so called pump-out), creating voids, and losing effectiveness, leading to overheating of electronic components and premature product failure.

Our synthetic-based, silicone-free thermal interface materials resist degradation caused by thermal cycling, which makes them suitable for use in a wide range of electronic and electromechanical applications. Depending on application requirements, users can choose from a wide array of formulas, each with unique features and benefits.

Common Features

  • Excellent heat transfer
  • Non-silicone
  • Non-hazardous
  • Will not dry, harden, or melt in normal use
  • Long shelf-life stability
  • RoHS and REACH compliant (lead-free)

Specialty Features

  • High-temperature operation at 250° C continuous
  • Low/no outgassing for vacuum environments
  • High dielectric strength
  • Easy to clean: water while retaining good moisture resistance
  • Ultra-thin bond line for minimum thermal resistance

Reference our Thermal Compound Selection Guide for easy comparison of key characteristics of our most popular formulas. Individual formula data sheets highlight features and benefits along with full technical details.

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