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Hot Bar Reflow Soldering Systems

Flex carriers and foil connectors

Hot Bar Reflow Soldering ApplicationMobile electronics such as telecommunications equipment, as well as the electronics in motor vehicles require increasing packing density and thus arrangement of the circuits in multiple layers. The connection of the layers are favorably produced with flexible circuit carriers and / or foil connectors.These connections are prepared, mostly by Hot Bar Reflow Soldering. For equipping electronic devices with digital displays, display drivers on flexible carriers can be used. The connection to the rigid circuit board can be produced by using thermode soldering too. Furthermore the method can be used to join flat cable and foil cable with rigid components like plug connectors and PCBs.

Process

For components that require a very precise positioning, Hot Bar Reflow Soldering is the most ideal process. Pulsed heated soldering differs from traditional soldering because the reflow of solder is accomplished using a heating element called a thermode which is heated and cooled down for each connection. Pressure is applied during the entire cycle including heating, reflow, and cooling. Because pressure is applied during the complete cycle, the process is very suitable for parts that could disconnect during cooling down. By using Hot Bar Reflow Soldering process multiple connections (up to > 100mm length) can be made simultaneously in a single process cycle. Making these connections simultaneously also prevents wires disconnecting while soldering the neighboring one.

Hot Bar Reflow Soldering Benefits
  • Fast temperature ramp-up and cool-down
  • Closed loop temperature control
  • Accurate positioning of the parts
  • Multiple connections can be made simultaneously
  • Cost effective due to elimination of third component such as connector

Applications Hot bar Reflow Soldering
  • Connecting flex-foils to Printed Circuit boards
  • Small wires
  • Small coax cables
  • Very light or small components.

 

Soldering applications:

Hot Bar Reflow Soldering Application   Hot Bar Reflow Soldering Application   Hot Bar Reflow Soldering Application

 

Your results for: Hot Bar Reflow Soldering Systems

C-Prime with touchscreen

Nordson DIMA

C-Prime Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in a fixed position, with an optional fixture, size up to 300 x 200 mm.

Soldering

Nordson DIMA

For components that require a very precise positioning, Hot Bar Reflow Soldering is the most ideal process. Pulsed heated soldering differs from traditional soldering because the reflow of solder is…

Nordson DIMA to Demonstrate Hot Bar Reflow Soldering and Automated Flux Dispensing with the C-TurnFlux System at IPC APEX Expo 2019

Nordson DIMA

Nordson DIMA, a division of Nordson Corporation (Nasdaq NDSN), will exhibit its C-TurnFlux system, the automated stand-alone hot bar system that combines flux dispensing with hot bar reflow…

C-Quence - Automated in-line solution system

Nordson DIMA

With C-Quence™ Nordson DIMA offers innovative automated and integrated in-line solutions for Hot Bar Reflow Soldering, Heat Seal Bonding, ACF Laminating and/or Heat Staking applications.  

C-TurnFlux

Nordson DIMA

The C-TurnFlux is the topline product for automated Flux Dispensing in combination with automated Hot Bar Reflow Soldering. An ultimate system for high end applications, where output and quality…

Nordson DIMA hot bar soldering solutions to be demonstrated at SMT Hybrid 2018

Nordson DIMA

Nordson DIMA, a division of Nordson Corporation (Nasdaq NDSN), will exhibit a range of products for hot bar soldering at SMT Hybrid 2018 in Nuremberg, Germany, June 5-7, 2018, in the AAT Aston GmbH…

C-Turn with touchscreen

Nordson DIMA

C-Turn Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in pneumatic turning unit with a diameter of 410 mm, with a fixture size up…

C-Slide with touchscreen

Nordson DIMA

C-Slide Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in a pneumatic slide of two or three positions (max. 150 mm stroke), with…

Nordson DIMA Launches New Website to Promote Hot Bar Soldering and Bonding Capabilities

Nordson DIMA

New website for Nordson DIMA's Hot Bar products

Productronica Munich 2019

Nordson DIMA

Join Nordson DIMA at Productronica, November 12-15, 2019 in Munich, Germany.

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Nordson DIMA

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