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Laminating

ACF Laminating applicationAnisotropic Conductive Film (ACF), is a lead-free and environmentally-friendly interconnect system to make electrical and mechanical connections between two components. ACFs are widely used to perform flex-to-board or flex-to-flex connections used in LCDs, handheld electronic devices such as mobile phones, MP3 players, or in the assembly of CMOS camera modules.

The ACF material is supplied as a reel and consists of adhesive filled with conductive particles and a protective layer. Prior to laminating (or pre-tacking) the ACF to the substrate, the ACF tape is pre-cut at the required length from the ACF reel. Cutting is done using the half-cut method where only the actual ACF material is cut, the cover-layer is used for tape transport. The ACF is now positioned over the bond surface, by placing the thermode (hot bar) on the ACF material and applying a certain amount of temperature and force, the material is transferred to the substrate.

Your results for: Laminating

ACF Laminating Systems

Nordson DIMA

Electrical conductive adhesive bonds can be made between flexible and rigid circuit boards, glass panel displays and flex foils. In the process the adhesive will be heated and cooled under pressure…

C-Quence - Automated in-line solution system

Nordson DIMA

With C-Quence™ Nordson DIMA offers innovative automated and integrated in-line solutions for Hot Bar Reflow Soldering, Heat Seal Bonding, ACF Laminating and/or Heat Staking applications.  

C-Tack with touchscreen

Nordson DIMA

C-Tack Desktop System for ACF Laminating, also called Pre-Tacking or Pre-Bonding. 

C-Prime with touchscreen

Nordson DIMA

C-Prime Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in a fixed position, with an optional fixture, size up to 300 x 200 mm.

C-Turn with touchscreen

Nordson DIMA

C-Turn Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in pneumatic turning unit with a diameter of 410 mm, with a fixture size up…

C-Slide with touchscreen

Nordson DIMA

C-Slide Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in a pneumatic slide of two or three positions (max. 150 mm stroke), with…

Video Library

Nordson DIMA

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C-Flow Controller with touchscreen

Nordson DIMA

The C-Flow Controller stands alone from other pulsed heat controllers with its unique integration of responsive temperature control and useful tools such as displacement monitoring and force control,…

Heat Seal Bonding Systems

Nordson DIMA

Electrical conductive adhesive bonds can be made between flexible and rigid circuit boards, glass panel displays and flex foils. In the process the adhesive will be heated and cooled under pressure…

SMTconnect Nuremberg 2019

Nordson DIMA

Join Nordson DIMA with AAT Aston at SMTconnect 2019 in Nuremberg 

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