Nordson DIMA

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Heat Seal bonding application The bonding products of Nordson DIMA are Hot Bar Bonding Systems. In this bonding process, flex or other parts are aligned with great accuracy to match the traces on the substrate that need bonding.…


ACF Tape on PCB b The ACF material is supplied as a reel and consists of adhesive filled with conductive particles and a protective layer. Prior to laminating (or pre-tacking) the ACF to the substrate, the ACF tape is…


Soldering - Nordson DIMA For components that require a very precise positioning, Hot Bar Reflow Soldering is the most ideal process. Pulsed heated soldering differs from traditional soldering because the reflow of solder is…

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