Wafer Inspection and Metrology
Nordson DAGE offer a comprehensive range of inline and lab based X-ray inspection and metrology solutions for assessing and monitoring wafer level quality.
- Check shape, fill level and voiding in TSV through silicon vias.
- Inspect build quality, wire bonds, component alignment and solder & adhesive voiding during MEMS manufacture.
- Check for bump presence, shape, position and voiding in wafer bumps.
- Find defects such as cold joints, head in pillow and misalignment in 2.5D and 3D wafer level packages.
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Quadra 7 is a versatile, lab based solution for wafer level inspection offering industry leading magnification and image quality.
Load wafers manually and check for sub-micron size defects using the intuitive, quick to learn Gensys™ point and click control software.
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All the benefits and performance of Quadra 7, with integrated wafer handling. Quadra W8 allows operators to inspect wafers directly from the FOUP without needing to handle the wafer
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The complete solution for operator free, automated X-ray wafer metrology. XM8000 is specifically designed for inline use in clean room environments.
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