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Stud pull

The stud-pull test measures the bond strength of dies and other flat components to the substrate. 

This is a complimentary technique to the more common die shear test, with both methods being used to get a full understanding of the die-substrate bond strength. Stud-pull is carried out in pure tension, so the stresses on the bond are less complex, so the bond performance is easier to model.

An important industry trend is for dies to become wider and thinner, which makes them more difficult to test using shear, so pull testing is becoming an essential technique. Shear tests can cause bending of the die or substrate during the test, so the stress state becomes a combination of shear and tension. This bending gets worst as the die area increases relative to the thickness of the die. Stud-pull testing eliminates this issue.

Stud pull