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Creep Testing

Time dependent deformation is an important failure mechanism. Our experience with solder has led us to develop methods for applying loads to small samples as the solder joint is the weakest connection in a printed circuit board.

The dimensional changes that occur with time when materials are statically loaded, is referred to as creep. Creep measurements are important for solders, polymers and adhesives where large strains can develop over time and strain rates are very temperature sensitive.


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Micro Materials Testing

Micro Materials Testing With 30 years' experience in small geometry testing, Nordson DAGE pioneers mirco materials testing, offering unrivalled expertise and capability across a range of materials and applications.

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