Nordson DAGE

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Wafer X-ray Metrology

Nordson DAGE is the market-leading provider of multi-award winning X-ray systems for the electronics industry. The XM8000 platform leverages this technology to provide unprecedented levels of non-destructive, high-throughput, automatic X-ray measurement and defect review of both optically hidden and visible features which includes TSVs, 3D packages and wafer bumps. In this way we are Measuring the Invisible™.
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XM8000 Wafer X-ray Metrology Platform

XM8000 Wafer X-ray Metrology Platform The Nordson DAGE XM8000 offers fast automatic X-ray measurement of TSVs, 3D packages, MEMS and wafer bumps for voiding, fill level, overlay and other critical dimensions.

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