Nordson DAGE award winning bondtesters equipment is recognized as the industry standard for bond testing.
The Nordson DAGE 4000Plus micro materials tester is fully optimized for small scale testing providing integrated imaging systems, precise positioning technology and micro gripping techniques
Nordson DAGE’s intelligent bond testing software Paragon™ takes bond testing to the next level. Its highly intuitive and configurable interface provides quick and easy access to advanced…
The Nordson DAGE XM8000 offers fast automatic X-ray measurement of TSVs, 3D packages, MEMS and wafer bumps for voiding, fill level, overlay and other critical dimensions.
Nordson DAGE's award winning X-ray inspection systems offer high resolution nano-focus not only for within failure analysis laboratories but also within the production environment.