Nordson DAGE

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Lighting & LED

LEDs present many advantages over incandescent light sources including lower energy consumption, longer lifetime and flexibility.

Modern LEDs are extremely bright, therefore generate heat which results in temperature increasingly becoming an issue. Heat stresses the die attach as well as the wire bond which causes displacement in the bulk of the moulding compound. Thermal and mechanical stress weakens the wire bond, eventually breaking it off. With this in mind, the manufacturing process needs to be carefully monitored and optimized to guarantee a long product life. 

The Nordson DAGE bondtesters provide market leading capability to cater to challenging test applications presented by light emitting diodes (LEDs) including; wire pull, ball shear, die shear of standard and low profile dies, tweezer and wafer level tests. 

Nordson DAGE X-ray systems are ideal for the inspection of these components. The super quick and high contrast live image together with the large tray size allow large quantities of LEDs to be inspected quickly and accurately.

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4000Plus Bondtester

4000Plus Bondtester The second generation Nordson DAGE 4000Plus is the most advanced bondtester on the market.  Representing the best-in-class, the 4000Plus bondtester sets the industry standard in bond testing offering…

4000 Optima Bondtester

4000 Optima Bondtester The fastest and most accurate bondtester. The Nordson DAGE 4000 Optima is optimized for fast, accurate and reliable bond testing in the volume manufacturing environment.  The combination of patented…

Computerized Tomography (CT) Option

Computerized Tomography (CT) Option The Nordson DAGE µCT inspection option provides Computerized Tomography (CT) functionality to compliment the 2D X-ray investigations on Nordson DAGE X-ray inspection systems

Heated Stage X-ray Option

Heated Stage X-ray Option The Heated Stage is specifically designed to observe solder paste flow in real time. The ability to simulate the temperature environment of a thermal oven or that of an external environment makes…

X-Plane System Option

X-Plane System Option Watch the video to find out more about X-Plane System option. 

Micro Materials Testing

Micro Materials Testing With 30 years' experience in small geometry testing, Nordson DAGE pioneers mirco materials testing, offering unrivalled expertise and capability across a range of materials and applications.

Paragon™ Software

Paragon™ Software Nordson DAGE’s intelligent bond testing software Paragon™ takes bond testing to the next level. Its highly intuitive and configurable interface provides quick and easy access to advanced…

Vision Systems

Vision Systems Nordson DAGE offers a range of powerful optical solutions for bondtesting and micro materials testing, featuring imaging systems for failure mode analysis, alignment and live recording of tests.

XD7800NT Ruby XL

XD7800NT Ruby XL The Solution for Large Board Applications

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