Nordson DAGE

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Electronics - Assembly & Packaging

Nordson DAGE bondtesters are widely used for precision destructive and non-destructive testing of components and assemblies.  Both manual and fully automatic testing solutions provide highest accuracy combined with intuitive and user friendly interface.

Nordson DAGE Jade, Ruby and Diamond X-ray inspection systems with CT and large board CT (X-Plane) provide the best in the industry X-ray inspection solutions for production, engineering, R&D, and failure analysis. Easy to use, providing highest quality images with sub-micron resolution (market leading 0.1 micron feature recognition for a Diamond system), are more than capable to handle demanding applications including metal cored boards and copper backed Ball Grid Arrays (BGAs).

The newly introduced Xi3400 fully automated X-ray inspection system is a must when an auto solution is required.

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Quadra™ 3

Quadra™ 3 High quality X-ray inspection for production applications. Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking…

Quadra™ 7

Quadra™ 7 At the cutting edge of X-ray inspection performance, Quadra 7 shows you features and defects as small as 0.1µm, non destructively.

4000Plus Bondtester

4000Plus Bondtester The second generation Nordson DAGE 4000Plus is the most advanced bondtester on the market.  Representing the best-in-class, the 4000Plus bondtester sets the industry standard in bond testing offering…

4000 Optima Bondtester

4000 Optima Bondtester The fastest and most accurate bondtester. The Nordson DAGE 4000 Optima is optimized for fast, accurate and reliable bond testing in the volume manufacturing environment.  The combination of patented…

4000HS High Speed Bondtester

4000HS High Speed Bondtester The Nordson DAGE 4000HS bondtester is based upon the industry standard Nordson DAGE 4000 multi-purpose bondtester platform. The 4000HS has significant differences to the mode of operation for both…

Unique Multi-Function Cartridges

Unique Multi-Function Cartridges Switch Applications in Just Seconds! Nordson DAGE’s thorough understanding of bond testing in the volume manufacturing environment underpins the no-compromise development of industry-unique…

4800 Bondtester

4800 Bondtester The Nordson DAGE 4800 is at the forefront of wafer testing technology catering for the testing of wafers from 200mm up to 450mm. Whilst heralding progression in bond testing technology it’s heritage…

4000 Multipurpose Bondtester

4000 Multipurpose Bondtester The 4000 bondtester is multipurpose, capable of performing all pull and shear applications. The 4000 bondtester can be configured as a simple wire pull tester and upgraded to provide ball shear, die…

Quadra™ 5

Quadra™ 5 Flexible X-ray inspection down to 0.35µm feature size. Quadra 5™ is the X-ray inspection system of choice for sub micron applications such as PCB and semiconductor package inspection, counterfeit…

Computerized Tomography (CT) Option

Computerized Tomography (CT) Option The Nordson DAGE µCT inspection option provides Computerized Tomography (CT) functionality to compliment the 2D X-ray investigations on Nordson DAGE X-ray inspection systems

X-Plane System Option

X-Plane System Option Watch the video to find out more about X-Plane System option. 

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