The second generation Nordson DAGE 4000Plus is the most advanced bondtester on the market. Representing the best-in-class, the 4000Plus bondtester sets the industry standard in bond testing offering…
The fastest and most accurate bondtester. The Nordson DAGE 4000 Optima is optimized for fast, accurate and reliable bond testing in the volume manufacturing environment.
The combination of patented…
The Nordson DAGE 4000HS bondtester is based upon the industry standard Nordson DAGE 4000 multi-purpose bondtester platform. The 4000HS has significant differences to the mode of operation for both…
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Nordson DAGE’s thorough understanding of bond testing in the volume manufacturing environment underpins the no-compromise development of industry-unique…
The Nordson DAGE µCT inspection option provides Computerized Tomography (CT) functionality to compliment the 2D X-ray investigations on Nordson DAGE X-ray inspection systems
The Heated Stage is specifically designed to observe solder paste flow in real time. The ability to simulate the temperature environment of a thermal oven or that of an external environment makes…
Watch the video to find out more about X-Plane System option.
With 30 years' experience in small geometry testing, Nordson DAGE pioneers mirco materials testing, offering unrivalled expertise and capability across a range of materials and applications.
Nordson DAGE’s intelligent bond testing software Paragon™ takes bond testing to the next level. Its highly intuitive and configurable interface provides quick and easy access to advanced…
Nordson DAGE offers a range of powerful optical solutions for bondtesting and micro materials testing, featuring imaging systems for failure mode analysis, alignment and live recording of tests.
High quality, real time imaging for production tasks, Jade FP is the cost effective choice for electronics inspection.
The Solution for Large Board Applications