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Quadruple Industry Recognition for Nordson DAGE Test and Inspection systems at Nepcon China 2018


Nordson DAGE 4800 Integra™ Automated Wafer Bondtester and Quadra™ 3 X-ray Inspection system win SMT China Vision and EM Asia Innovation Awards

Nordson DAGE announces that it was recognized with four awards for its Test and Inspection systems during Nepcon China, the prestigious global exhibition on SMT (surface mount technology) and EMA (electronics manufacturing automation) that brings together all major brands from the electronics manufacturing industry, held in Shanghai 24th – 26th April 2018.
At the SMT Vision Award Ceremony, which recognizes people and products within the surface mount industry that serve as benchmarks of excellence, the Nordson DAGE Quadra™ 3 X-ray Inspection system and 4800 Integra™ Integrated Automated On-Wafer Bondtester were recognized in the respective categories of “Testing Equipment and Inspection” and “Testing – Bondtester.”  Both systems were again recognized for outstanding innovation in the “Test and Inspection Systems” category of the EM Asia Innovation Awards, which was launched in 2006 to celebrate excellence in the Asian electronics industry.

“Nordson DAGE is delighted to have been recognized with these awards. The 4800 Integra™ and the Quadra™ 3 are leading edge products resulting from core R&D programs and close collaboration with our customers in China,” commented Phil Vere, Vice President of Test and Inspection Systems.  

The 4800 Integra™ is the complete solution for automated wafer bond testing.  The entire system is factory configured and controlled from one PC.  The system is completely controlled via Paragon™ software and once programmed will perform all parts of the test automatically, with no need for operator input.  When combined with a FOUP loading system, testing, analysis and results can be entirely automated.

With 0.95 µm feature recognition and X-Plane® image slice technology, Quadra™ 3 is perfectly designed for PCBA production line quality control.  Inspecting a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking and counterfeit device screening, Quadra 3 is an exceptional tool for screening quality defects in electronics production.