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Nordson DAGE Announces Latest Order for XM8000 and Attendance at IWLPC


The Fastest Fully Automatic X-ray Metrology tool for Wafer Bumps and TSV’s

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), is pleased to announce its most recent order from a major customer in the semiconductor industry for its XM8000 wafer X-ray metrology tool that will be used for the automatic measurement of wafer bumps and through silicon vias (TSVs) by using 2D and 3D X-ray inspection methods.

David Bernard, Business Manager Automated X-ray Systems commented “ The XM8000 represents an entirely new paradigm using Nordson DAGE’s award winning X-ray technology in the heart of semiconductor manufacture, and that is why our system was selected for this project. By offering full, non-destructive and automatic metrology, not only can the XM8000 measure the level of voiding in bumps and TSV’s, something that is invisible to other test methods, it can also measure their visible critical dimensions. Furthermore it can do all this substantially faster and with greater precision than existing systems.”

For more information see, or visit the Nordson DAGE booth at the upcoming International Wafer-Level Packaging Conference (IWLPC) taking place November 11-13, 2014 at the DoubleTree by Hilton Hotel, San Jose, CA.