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IMAPS Device Packaging 2018

WekoPa Resort and Casino, Fountain Hills, Arizona USA

05 Mar 2018 - 08 Mar 2018

Nordson ASYMTEK presenting on underfill dispensing for chip-on-wafer and high-throughput jetting in micro-device packaging at iMAPS Device Packaging Conference.

Mr. Akira Morita from Nordson ASYMTEK will be presenting Underfill dispensing for chip-on-wafer on Wednesday March 7th, room 011, from 2:00pm - 2:30pm.

The chip-on-wafer process is becoming a critical one along with the rapid emergence of 3D package, stacked wafer level CSP (WLCSP), and chip-last process for WLCSP. The demands for cost reduction and miniaturization challenge the chip-on-wafer process exponentially. For example, the scribe line width on wafer and interconnect gap between chip and wafer are becoming tighter. These tighter geometries make underfill dispensing time consuming due to smaller dot requirement. In addition, the tighter geometries increase the need for high accuracy in placement and volume. These factors are important because of the high value of the wafer and the reality that a single yield issue can affect hundreds of chips.

Mr. Akira Morita from Nordson ASYMTEK will also be presenting high-throughput jetting in micro-device packaging on Thursday March 8th, room 034, from 10:45am - 11:15am.

In Flip Chip and Chip on Board packages, coating and encapsulation materials are applied on the die and the components to protect them from physical stress, contamination, invasion, electrical bridging, etc. Advanced micro-device packaging sets a high and dynamic standard for its supplier industries for speed, precision and flexibility. Manufacturers are being asked to apply protection on more dies in more complicated geometries, in smaller spaces, in shorter process time, and to dispense the protection materials during any packaging process. This brings increased challenges for dispensing equipment, such as the ability to match high throughput with upstream pick and place processes in production line while maintaining precision and repeatability.

March 5-8, 2018
WekoPa Resort and Casino
Fountain Hills, Arizona USA
IMAPS Device Packaging

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