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Bondexpo 2019

Stuttgart, Germany

2019-10-07 - 2019-10-10

Join Nordson ASYMTEK at Bondexpo 2019

Helios SD-960

Bond Expo 2018


Come see our new Helios™ Series SD-960 Large Volume Fluid Dispensing System.

The Helios™ SD-960 Series is developed for medium to large volume dispensing applications in Electronics Assembly, like Thermal Interface Material (TIM), Potting, Gasketing and Sealing.
The new Helios™ SD-960 Series (SD-960) handles a broad range of single- and two-component applications including Potting, Sealing, Gasketing, and Structural Adhesives. The system supports highly abrasive Thermal Interface Materials (TIMs), silicones, epoxies, and grease.

Joint stand with Nordson EFD and Nordson ICS.

Landesmesse Stuttgart GmbH, Messepiazza, 70629 Stuttgart.

Oct 7-10, 2019

Free Registration - Bondexpo 2019


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