Adhesive Dispensing Systems

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LogiComm® Integrated Pattern Control and Verification System

Modular pattern control and verification systems provide a building block approach to integrating control and verification capabilities as needed. The system controls and verifies hot melt and cold adhesive placement and volume even for short runs and complex patterns. Additional verification features enhance on-line quality assurance.

  • Use in applications up to 1200 meters per minute (3937 fpm) with pattern accuracy of ±0.25 mm (0.01 in.).

  • Provide upgradeability by allowing installation of either pattern control or verification initially, with capability to easily integrate the other function as needed.

  • Complete changeovers quickly with virtually unlimited memory.

  • Protect product integrity by inspecting adhesive volume and position, bar codes, overlapped or skewed substrates, cellophane windows, security tags and flap faults.