印制电路板组装

技术论文

Fluid Dispensing Processes for Next Generation Electronics
H. Quinones (Pan Pacific, Hawaii 2003) (PDF 196 KB)

Jetting Technology: A Way of the Future in Dispensing
H. Quinones, A. Babiarz, L. Fang (EMAP, Taiwan, October 2002) (PDF 170 KB)

Jetting Technology for Microelectronics
H. Quinones, A. Babiarz, L. Fang (IMAPS Nordic, Stockholm, Sweden September 2002) (PDF 197 KB)

Advantages of Non-Contact Dispensing in SMT Assembly Processes
A. F. Piracci (SMTA/ATE, Chicago, IL, September 2000) (PDF 91 KB) 
 
Practical Production Applications for Jetting Technology
A. F. Piracci (APEX 2000, Long Beach, CA, March 2000) (PDF 992 KB)

文章

Successful Jetting in SMT 
D. Ashley, A. Lewis (SMT Magazine, May 2007) (PDF 278 KB) 
 
Jetting - Dispense Technology of Choice for Adhesives
A. Lewis (SMT Magazine, March 2006) (PDF 322 KB)

应用实例

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技术论文

Formulation Considerations for Automated Dispensing of Lead Free Solder Paste
A. Lewis (2003) (PDF 254 KB)

文章

Advancements in Solder Paste Dispensing
D. Ashley, S. Adamson (SMT Magazine, July 2008) (PDF 500 KB)

Is Your Solder Paste Dispensable?
E.L. Austin and A.R. Lewis (SMT magazine, July 1996) (PDF 557 KB)

应用实例

技术论文

Jetting Technology: A Way of the Future in Dispensing
H. Quinones, A. Babiarz, L. Fang (EMAP, Taiwan, October 2002) (PDF 170 KB) 
 
Jetting Technology for Microelectronics
H. Quinones, A. Babiarz, L. Fang (IMAPS Nordic, Stockholm, Sweden September 2002) (PDF 197 KB)

文章

Jetting PoP Underfill
B. Perkins (Advanced Packaging magazine, November/December 2008) (PDF 563 KB)

Jetting Small Dots of High Viscosity Fluids for Packaging Applications
A. Babiarz (Seminconductor International, August 2006) (PDF 688 KB)

应用实例

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