Nordson Corporation

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Wafer X-ray Metrology

Measure the Invisible™ with Nordson DAGE.  Automatic X-ray measurement of TSVs, MEMS and wafer bumps for voiding, fill level, overlay and other critical dimensions.  Also be sure to browse the rest of our x-ray inspection, bond tester and automated optical inspection (AOI) offering.

XM8000 Wafer X-ray Metrology Platform

XM8000 Wafer X-ray Metrology Platform The Nordson DAGE XM8000 offers fast automatic X-ray measurement of TSVs, 3D packages, MEMS and wafer bumps for voiding, fill level, overlay and other critical dimensions.

Nordson DAGE


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