Nordson Corporation

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NASDAQ $125.83   +1.17

Melters

AltaBlue™ Touch Series Melters

AltaBlue™ Touch Series Melters Optional, integrated pressure & flow monitoring and control for demanding applications such as nonwovens

Adhesive Dispensing Systems

AltaBlue™ TT Melters

AltaBlue™ TT Melters Visual and graphical controls provide easy operation and maintenance

Adhesive Dispensing Systems

AltaPail™ II Bulk Melters (Heated)

AltaPail™ II Bulk Melters (Heated) Precise, demanding variable-speed adhesive application from 20-liter/5-gallon pails

Adhesive Dispensing Systems


AltaPUR Adhesive Melters

AltaPUR Adhesive Melters Efficiently process hot melt reactive PUR adhesives from foil-encased or polymer form-liner slugs.  

Adhesive Dispensing Systems

Bulk Melters

Bulk Melters Nordson bulk glue melters efficiently process hot melt adhesives, glues, sealants or butyls from drums or pails.

Industrial Coating Systems

DuraBlue® II Melters

DuraBlue® II Melters Provide easy, reliable material delivery for low to mid-speed adhesive bonding processes.

Adhesive Dispensing Systems


DuraBlue® Melters

DuraBlue® Melters Simple installation, set-up, operation and maintenance for automated and handgun manufacturing operations

Adhesive Dispensing Systems

DuraDrum® Bulk Melters (Heated)

DuraDrum® Bulk Melters (Heated) Simply, efficiently process hot melt materials, protecting adhesive integrity and providing production flexibility

Adhesive Dispensing Systems

DuraPail® Bulk Melters (Heated)

DuraPail® Bulk Melters (Heated) Bulk material processing with simple operation and low maintenance offers production flexibility

Adhesive Dispensing Systems


EEX Extruder Systems

EEX Extruder Systems Safe, homogenous, high-quality processing of hot melt adhesive granules

Adhesive Dispensing Systems

EX Hot Melt Adhesive Extruders

EX Hot Melt Adhesive Extruders Application flexibility for a range of processing temperatures and pressures

Adhesive Dispensing Systems

EZ Melt Melter

EZ Melt Melter Easy, reliable material delivery for low- to mid-speed bonding processes

Adhesive Dispensing Systems


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