Nordson Corporation

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NASDAQ $138.57   -0.32

Semiconductor Manufacturing

Order semiconductor manufacturing equipment from Nordson

If you work in electronics, specifically in semiconductor fabrication, we can help ensure you have the tools necessary to enhance your workflow and improve your end product. With Nordson semiconductor manufacturing equipment, including bondtesters, dual dispensers and UV curing ovens, you can create packaging to protect against impact and corrosion. Additionally, our wafer processing equipment will help you find efficiencies in cleaning and etching wafers. Browse our various semiconductor manufacturing solutions, parts and equipment below to find what you need for exceptional control and reliability. Then contact us to see how we can integrate into your business. 

Nordson highlighted products and solutions for semiconductor equipment manufacturers:

Nordson ASYMTEK automated fluid dispensing equipment for advanced semiconductor manufacturing packaging - flip chips, 3D packages, wafer-level packages, PoPs and SiPs.

Nordson MARCH plasma treatment solutions for cleaning, wire bond improvement, descum, bump adhesion, stripping and etching during semiconductor manufacturing.
   
Nordson DAGE x-ray inspection and bondtesting equipment and Nordson YESTECH automated optical inspection AOI solutions.

Nordson EFD semi-automated dispense systems, syringes and tips.

UV curing equipment for semiconductor fabrication.  
 

Cartridge Pistons

Cartridge Pistons Optimum® cartridge pistons are precision molded from high-density polyethylene to fit perfectly within Nordson EFD cartridges, preventing blow-by and leakage during filling and storage. 

Nordson EFD

Cartridge Retainer Systems

Cartridge Retainer Systems Molded from high-tensile, clear plastic, Optimum® cartridge retainers make it easy to visually monitor fluid levels during dispensing – an industry first. 

Nordson EFD

C-Base with touchscreen

C-Base with touchscreen The C-Base Bonding/Soldering system is a combination of a C-Flow and a C-Drive module and stands alone from other pulsed heat controllers with its unique integration of responsive temperature control…

Nordson DIMA


C-Drive Head

C-Drive Head The C-Drive Bond Head is designed to deliver quality solder joints and Heat Seal bonds consistently. When coupled with a C-Flow Controller, Temperature, Force, and Displacement Monitoring give…

Nordson DIMA

C-Flow Controller with touchscreen

C-Flow Controller with touchscreen The C-Flow Controller stands alone from other pulsed heat controllers with its unique integration of responsive temperature control and useful tools such as displacement monitoring and force control,…

Nordson DIMA

Chamfered Tips

Chamfered Tips Ideal for microdot applications of low viscosity fluids.

Nordson EFD


Cleaning Stations

Cleaning Stations For automated nozzle cleaning of jet valves and needle valves.

Nordson EFD

Continuous Path Motion Control

Continuous Path Motion Control Nordson ASYMTEK's Continuous Path Motion Control maintains a continuous speed and direction during dispensing thus saving dispense time and increasing UPH

Nordson ASYMTEK

CoolWave 2 410 System

CoolWave 2 410 System The microwave-powered CoolWave® 2 410 system provides improved flexibility and easy maintenance for industrial curing applications.

Industrial Coating Systems


CoolWave 2 610 System

CoolWave 2 610 System The microwave-powered CoolWave® 2 610 system provides improved flexibility and easy maintenance for industrial curing applications.

Industrial Coating Systems

CoolWave 306 System

CoolWave 306 System The microwave-powered CoolWave 306 system provides improved flexibility and easy maintenance for industrial curing applications.

Industrial Coating Systems

C-Prime with touchscreen

C-Prime with touchscreen C-Prime Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in a fixed position, with an optional fixture, size up to 300 x 200 mm.

Nordson DIMA


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