Nordson Corporation

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NASDAQ $127.56   -0.79

Semiconductor Manufacturing

Order semiconductor fabrication equipment from Nordson

If you work in electronics, specifically in semiconductor fabrication, we can help ensure you have the tools necessary to enhance your workflow and improve your end product. With Nordson semiconductor manufacturing equipment, including bondtesters, dual dispensers and UV curing ovens, you can create packaging to protect against impact and corrosion. Additionally, our wafer processing equipment will help you find efficiencies in cleaning and etching wafers. Browse our various semiconductor manufacturing solutions, parts and equipment below to find what you need for exceptional control and reliability. Then contact us to see how we can integrate into your business. 

Nordson highlighted products and solutions for semiconductor equipment manufacturers:

Nordson ASYMTEK automated fluid dispensing equipment for advanced semiconductor manufacturing packaging - flip chips, 3D packages, wafer-level packages, PoPs and SiPs.

Nordson MARCH plasma treatment solutions for cleaning, wire bond improvement, descum, bump adhesion, stripping and etching during semiconductor manufacturing.
   
Nordson DAGE x-ray inspection and bondtesting equipment and Nordson YESTECH automated optical inspection AOI solutions.

Nordson EFD semi-automated dispense systems, syringes and tips.

UV curing equipment for semiconductor fabrication.  
 

XM8000 Wafer X-ray Metrology Platform

XM8000 Wafer X-ray Metrology Platform The Nordson DAGE XM8000 offers fast automatic X-ray measurement of TSVs, 3D packages, MEMS and wafer bumps for voiding, fill level, overlay and other critical dimensions.

Nordson DAGE


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