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Solder Paste Inspection Equipment

The FX-500 ULTRA 3D SPI provides 3D height, volume and area metrology for PCB boards with complex and small pad sizes where solder volume definition is critical for joint reliability.
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FX-500 Ultra 3D SPI

FX-500 Ultra 3D SPI Nordson YESTECH's FX-500 ULTRA 3D SPI provides 3-D height, volume and area metrology for PCB boards with complex and small pad sizes where solder volume definition is critical for joint reliability.…


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